Features of Laser Marking MachinesThe recognized principles are two."Thermal processing" has a high energy density laser beam (it is a concentrated stream of energy), irradiated on the surface of the material being processed, the material surface absorbs laser energy and generates a thermal excitation process in the irradiated area, which causes the temperature of the material surface (or coating) to rise, resulting in metamorphosis, melting, ablation, evaporation and other phenomena."Cold processing" has a very high load energy (ultraviolet) photons, which can break the chemical bonds within the material (especially organic materials) or the surrounding medium, to the point that the material is destroyed by non-thermal processes. This cold processing has special significance in laser mark processing because it is not thermal ablation, but rather cold peeling that breaks chemical bonds without the side effect of "thermal damage" and thus does not produce heating or thermal deformation of the inner layer of the surface being processed and the surrounding area. For example, excimer lasers are used in the electronics industry to deposit thin films of chemicals on substrate materials and to create narrow slots in semiconductor substrates.Comparison of different marking methodsCompared with the inkjet marking method, the superiority of laser marking and engraving lies in: wide range of applications, a variety of substances (metal, glass, ceramics, plastics, leather, etc.) can be marked with permanent high-quality markings. No force on the surface of the workpiece, no mechanical deformation, no corrosion on the surface of the substance.